- 産業: Semiconductors
- Number of terms: 2987
- Number of blossaries: 0
- Company Profile:
National Semiconductor Corporation designs, develops, manufactures, and markets analog and mixed-signal integrated circuits and sub-systems.
The growth of a filament between two conductive areas as the result of high thermal or voltage stress, shorting the two areas together.
Industry:Semiconductors
A thin package with ribbon leads coming out opposite sides of the package. (See also bottom-brazed flat.)
Industry:Semiconductors
On a flat pack device, a lead which exits from the end rather than the side of the package, then makes a right-angle turn to parallel the other leads.
Industry:Semiconductors
The applied voltage(s) or current(s) at which a parametric or functional test is performed.
Industry:Semiconductors
Any material that is foreign to a microcircuit or any non-foreign material that is displaced from its original or intended position within a microcircuit package.
Industry:Semiconductors
Sealing accomplished through the melting and re-hardening of a glass seal ring (or frit) between the package base and lid. The package leads typically pass through the sealing area.
Industry:Semiconductors
A slang term often applied to the wafer fabrication portion of the semiconductor manufacturing process.
Industry:Semiconductors
A semiconductor base material whose high electron mobility has led it to be used in the fabrication of high speed circuits. GaAs circuits are not considered as easy to manufacture as silicon circuits.
Industry:Semiconductors
An integrated circuit containing a large number of gates that can be interconnected in any number of combinations to satisfy specific individual applications (see ASIC, CSIC).
Industry:Semiconductors
The basic unit of measure for digital circuit complexity, based upon the number of individual logic gates that would have to be interconnected to perform the same circuit function.
Industry:Semiconductors
