- 産業: Semiconductors
- Number of terms: 2987
- Number of blossaries: 0
- Company Profile:
National Semiconductor Corporation designs, develops, manufactures, and markets analog and mixed-signal integrated circuits and sub-systems.
A region of surface conduction opposite in type from that expected from the bulk doping. Channels are sometimes introduced unintentionally by surface ionic contamination. The type of channel (P or N) will be determined by the type of majority carrier introduced into the channel.
Industry:Semiconductors
See ultrasonic bonding (although Stitch bonding is occasionally called wedge bonding as well).
Industry:Semiconductors
Electrical testing performed for the purpose of determining typical device performance characteristics and/or parametric limits.
Industry:Semiconductors
Semiconductor device sealing accomplished by welding a metal lid to a metal package (typically employed for metal can devices).
Industry:Semiconductors
A carrier of electrical charge within the crystal of a solid state device, such as an electron or a hole.
Industry:Semiconductors
Radiographic analysis of the construction of a device. This is a less useful technique for devices with aluminum bond wires since only die attach and seal defects can be evaluated. For devices with gold wire it is a more valuable screen as it can detect damage done to wires during centrifuge and other such tests, as well as most assembly defects.
Industry:Semiconductors
A leadless package used in the construction of both hybrids and boards. The chip carrier has a body configuration similar to a flat pack, but electrical connection is made through contacts on the package base rather than through conventional leads.
Industry:Semiconductors
The total number of devices which are electrically and mechanically within applicable specifications, expressed as a percentage of the total population.
Industry:Semiconductors
Post assembly 100% electrical sort testing; not to be confused with the product assurance classes defined by MIL-STD-883.
Industry:Semiconductors
Per MIL-STD-883, there are two product assurance classes representing different levels of anticipated device reliability: Class B, which is intended for airborne equipment; and Class S, which is intended for space flight.
Industry:Semiconductors
